Disco (OTCMKTS:DSCSY) Sets New 12-Month Low – Time to Sell?

Disco Corp (OTCMKTS:DSCSY)’s share price hit a new 52-week low during trading on Thursday. The stock traded as low as $25.40 and last traded at $25.40, with a volume of 8,601 shares. The stock had previously closed at $31.21.

Analysts Set New Price Targets

A number of research analysts have recently weighed in on the company. Jefferies Financial Group upgraded Disco from a “hold” rating to a “buy” rating in a report on Monday, July 27th. Zacks Research upgraded Disco from a “hold” rating to a “strong-buy” rating in a report on Monday, October 5th. One analyst has rated the stock with a Strong Buy rating and one has assigned a Buy rating to the stock. Based on data from MarketBeat, Disco presently has an average rating of “Strong Buy”.

Disco Price Performance

The company’s fifty day moving average price is $34.83 and its 200 day moving average price is $41.57. The company has a market cap of $26.54 billion, a PE ratio of 26.02 and a beta of 1.67.

Disco (OTCMKTS:DSCSY) last released its quarterly earnings results on Thursday, October 22nd. The company reported $0.27 earnings per share for the quarter. Disco had a net margin of 32.04% and a return on equity of 27.68%. The business had revenue of $897.04 million for the quarter. On average, analysts forecast that Disco Corp will post 1.11 EPS for the current year.

Hedge Funds Weigh In On Disco

A hedge fund recently bought a new position in Disco stock. Azimuth Capital Investment Management LLC bought a new position in Disco Corp (OTCMKTS:DSCSY) during the second quarter, according to the company in its most recent 13F filing with the SEC. The fund bought 237,250 shares of the company’s stock, valued at approximately $11,862,000. Hedge funds and other institutional investors own 0.03% of the company’s stock.

Disco Company Profile

DISCO Corporation is a Japan-based manufacturer of precision equipment and tools used in the semiconductor and electronics industries. The company develops and produces systems for wafer dicing, grinding and polishing, as well as related consumables such as diamond wheels and other cutting tools.

Its products are used to separate semiconductor wafers into individual chips and to shape, thin and finish semiconductor materials with high precision. DISCO also provides equipment, tools and technical support for applications involving silicon, compound semiconductors and other electronic materials.

Founded in 1937 and headquartered in Tokyo, DISCO serves customers internationally through a global network of sales, service and production operations.