BE Semiconductor Industries (OTCMKTS:BESIY) Reaches New 1-Year High – Still a Buy?

Shares of BE Semiconductor Industries NV (OTCMKTS:BESIYGet Free Report) reached a new 52-week high during mid-day trading on Monday . The company traded as high as $230.44 and last traded at $230.44, with a volume of 13602 shares traded. The stock had previously closed at $223.92.

Analyst Upgrades and Downgrades

A number of equities analysts have issued reports on BESIY shares. Sanford C. Bernstein reiterated an “outperform” rating on shares of BE Semiconductor Industries in a research note on Sunday, January 4th. Morgan Stanley reaffirmed an “overweight” rating on shares of BE Semiconductor Industries in a report on Tuesday, January 13th. Kepler Capital Markets lowered BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a report on Friday, January 9th. Citigroup restated a “neutral” rating on shares of BE Semiconductor Industries in a research report on Tuesday, January 20th. Finally, Needham & Company LLC upgraded shares of BE Semiconductor Industries to a “buy” rating in a research report on Tuesday, January 6th. Five analysts have rated the stock with a Buy rating and five have given a Hold rating to the stock. According to MarketBeat.com, the stock presently has a consensus rating of “Moderate Buy”.

Read Our Latest Stock Report on BESIY

BE Semiconductor Industries Stock Performance

The company has a debt-to-equity ratio of 1.46, a current ratio of 5.75 and a quick ratio of 5.02. The stock has a market cap of $16.71 billion, a PE ratio of 123.23 and a beta of 1.85. The business has a 50 day moving average price of $187.69 and a two-hundred day moving average price of $164.13.

About BE Semiconductor Industries

(Get Free Report)

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.

Further Reading

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