Disco (OTCMKTS:DSCSY) Sees Large Volume Increase – Here’s What Happened

Disco Corp (OTCMKTS:DSCSY) shares saw unusually-strong trading volume on Friday . 363,268 shares were traded during trading, an increase of 20% from the previous session’s volume of 302,239 shares.The stock last traded at $36.7412 and had previously closed at $30.97.

Wall Street Analyst Weigh In

Several brokerages recently weighed in on DSCSY. Jefferies Financial Group upgraded Disco from a “hold” rating to a “buy” rating in a research note on Monday. Zacks Research downgraded Disco from a “strong-buy” rating to a “hold” rating in a research report on Tuesday, May 19th. One analyst has rated the stock with a Buy rating and one has assigned a Hold rating to the company. Based on data from MarketBeat.com, the company has an average rating of “Moderate Buy”.

Disco Trading Down 0.7%

The business’s fifty day simple moving average is $44.58 and its two-hundred day simple moving average is $44.30. The stock has a market capitalization of $37.96 billion, a P/E ratio of 40.22 and a beta of 1.50.

Disco (OTCMKTS:DSCSY) last posted its quarterly earnings data on Thursday, July 23rd. The company reported $0.20 earnings per share (EPS) for the quarter. The company had revenue of $717.28 million for the quarter. Disco had a net margin of 31.65% and a return on equity of 26.08%. On average, equities research analysts anticipate that Disco Corp will post 1.05 earnings per share for the current year.

About Disco

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.