Short Interest in Disco Corp (OTCMKTS:DSCSY) Expands By 486.9%

Disco Corp (OTCMKTS:DSCSY) was the recipient of a large increase in short interest during the month of June. As of June 30th, there was short interest totaling 115,925 shares, an increase of 486.9% from the June 15th total of 19,753 shares. Based on an average daily trading volume, of 782,291 shares, the short-interest ratio is currently 0.1 days. Approximately 0.0% of the shares of the stock are short sold.

Analyst Upgrades and Downgrades

Separately, Zacks Research lowered Disco from a “strong-buy” rating to a “hold” rating in a report on Tuesday, May 19th. One research analyst has rated the stock with a Hold rating, Based on data from MarketBeat.com, the stock currently has a consensus rating of “Hold”.

Disco Trading Down 0.0%

Shares of OTCMKTS:DSCSY traded down $0.01 on Friday, hitting $45.42. 109,302 shares of the company were exchanged, compared to its average volume of 374,458. The stock’s 50 day moving average price is $46.19 and its 200 day moving average price is $43.51. The firm has a market capitalization of $49.27 billion, a P/E ratio of 55.39 and a beta of 1.50. Disco has a 1-year low of $24.94 and a 1-year high of $58.00.

Disco (OTCMKTS:DSCSY) last posted its earnings results on Wednesday, April 22nd. The company reported $0.25 earnings per share (EPS) for the quarter. Disco had a net margin of 30.95% and a return on equity of 25.27%. The firm had revenue of $848.13 million during the quarter, compared to analysts’ expectations of $771.53 million. On average, equities analysts predict that Disco will post 1.05 EPS for the current fiscal year.

Disco Company Profile

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.