Shares of BE Semiconductor Industries NV (OTCMKTS:BESIY – Get Free Report) gapped up before the market opened on Friday . The stock had previously closed at $156.7550, but opened at $171.15. BE Semiconductor Industries shares last traded at $173.71, with a volume of 818 shares changing hands.
Analyst Ratings Changes
Several analysts recently weighed in on the company. Deutsche Bank Aktiengesellschaft restated a “buy” rating on shares of BE Semiconductor Industries in a research note on Wednesday, October 15th. UBS Group restated a “buy” rating on shares of BE Semiconductor Industries in a report on Friday, October 24th. Finally, Zacks Research raised BE Semiconductor Industries from a “strong sell” rating to a “hold” rating in a research report on Tuesday, October 14th. One analyst has rated the stock with a Strong Buy rating, three have issued a Buy rating and five have given a Hold rating to the stock. Based on data from MarketBeat.com, the stock has an average rating of “Moderate Buy”.
View Our Latest Analysis on BE Semiconductor Industries
BE Semiconductor Industries Price Performance
BE Semiconductor Industries (OTCMKTS:BESIY – Get Free Report) last posted its earnings results on Thursday, October 23rd. The technology company reported $0.37 earnings per share (EPS) for the quarter, beating the consensus estimate of $0.31 by $0.06. BE Semiconductor Industries had a net margin of 25.42% and a return on equity of 33.98%. The business had revenue of $154.12 million for the quarter, compared to analysts’ expectations of $160.84 million. On average, equities research analysts anticipate that BE Semiconductor Industries NV will post 4.56 EPS for the current year.
BE Semiconductor Industries Company Profile
BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.
Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.
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