Disco (OTCMKTS:DSCSY) Shares Gap Down – Here’s What Happened

Posted by Donald Scott on Sep 24th, 2026

Shares of Disco Corp (OTCMKTS:DSCSY – Get Free Report) gapped down before the market opened on Thursday . The stock had previously closed at $34.65, but opened at $33.01. Disco shares last traded at $33.4950, with a volume of 1,144 shares.

Analysts Set New Price Targets

Separately, Jefferies Financial Group upgraded shares of Disco from a “hold” rating to a “buy” rating in a research note on Monday, July 27th. One research analyst has rated the stock with a Buy rating and one has issued a Hold rating to the stock. According to MarketBeat.com, the stock has a consensus rating of “Moderate Buy”.

Get Our Latest Research Report on Disco

Disco Stock Performance

The stock has a market capitalization of $36.29 billion, a PE ratio of 38.44 and a beta of 1.54. The stock’s 50 day moving average is $36.95 and its two-hundred day moving average is $42.15.

Disco (OTCMKTS:DSCSY – Get Free Report) last announced its quarterly earnings results on Thursday, July 23rd. The company reported $0.20 earnings per share for the quarter. Disco had a net margin of 31.65% and a return on equity of 26.03%. The firm had revenue of $717.28 million for the quarter. Equities research analysts expect that Disco Corp will post 1.11 EPS for the current fiscal year.

Institutional Investors Weigh In On Disco

An institutional investor recently bought a new stake in Disco stock. Azimuth Capital Investment Management LLC purchased a new position in shares of Disco Corp (OTCMKTS:DSCSY – Free Report) during the second quarter, according to its most recent filing with the Securities and Exchange Commission (SEC). The institutional investor purchased 237,250 shares of the company’s stock, valued at approximately $11,862,000. 0.03% of the stock is currently owned by institutional investors.

About Disco

(Get Free Report)

DISCO Corporation, traded in the United States under the symbol DSCSY, is a Japanese manufacturer of precision processing equipment and tools used primarily in semiconductor and electronic-component production. The company develops technologies for cutting, grinding and polishing hard, brittle materials such as silicon, compound semiconductors, glass and ceramics.

Its product portfolio includes wafer-dicing saws, grinding and polishing systems, laser-based processing equipment, and the consumable blades, wheels and other tools used with those machines.