Disco (OTCMKTS:DSCSY) Shares Gap Up – Here’s Why

Disco Corp (OTCMKTS:DSCSY) shares gapped up prior to trading on Monday . The stock had previously closed at $36.98, but opened at $38.47. Disco shares last traded at $37.8450, with a volume of 23,055 shares.

Analyst Upgrades and Downgrades

DSCSY has been the topic of several recent research reports. Zacks Research downgraded shares of Disco from a “strong-buy” rating to a “hold” rating in a report on Tuesday, May 19th. Jefferies Financial Group upgraded shares of Disco from a “hold” rating to a “buy” rating in a research note on Monday, July 27th. One investment analyst has rated the stock with a Buy rating and one has assigned a Hold rating to the company. According to MarketBeat.com, the company has an average rating of “Moderate Buy”.

Disco Trading Down 1.6%

The firm has a market cap of $40.92 billion, a P/E ratio of 43.36 and a beta of 1.55. The business’s fifty day simple moving average is $43.20 and its 200-day simple moving average is $44.11.

Disco (OTCMKTS:DSCSY) last posted its quarterly earnings results on Thursday, July 23rd. The company reported $0.20 EPS for the quarter. The firm had revenue of $717.28 million during the quarter. Disco had a return on equity of 26.03% and a net margin of 31.65%. As a group, research analysts expect that Disco Corp will post 1.05 earnings per share for the current fiscal year.

Institutional Inflows and Outflows

A hedge fund recently bought a new position in Disco stock. Azimuth Capital Investment Management LLC purchased a new stake in shares of Disco Corp (OTCMKTS:DSCSY) during the 2nd quarter, according to its most recent filing with the Securities & Exchange Commission. The institutional investor purchased 237,250 shares of the company’s stock, valued at approximately $11,862,000. 0.03% of the stock is owned by institutional investors and hedge funds.

Disco Company Profile

Disco (OTCMKTS: DSCSY) is a manufacturer of precision processing equipment and consumables for the semiconductor and electronics industries. The company’s product portfolio includes wafer dicing saws, wafer thinning and grinding systems, laser dicing equipment, polishing systems, and diamond blades and wheels, along with associated tooling and process consumables designed for high-precision cutting and surface finishing.

Disco’s products are used in critical back-end semiconductor manufacturing steps such as dicing, singulation, thinning, surface preparation and polishing across applications including IC packaging, power devices, LEDs, MEMS and sensors.