BE Semiconductor Industries (OTCMKTS:BESIY) Announces Earnings Results, Misses Estimates By $0.01 EPS

BE Semiconductor Industries (OTCMKTS:BESIY) posted its quarterly earnings data on Thursday. The technology company reported $1.29 earnings per share for the quarter, missing analysts’ consensus estimates of $1.30 by ($0.01), Zacks reports. The firm had revenue of $290.52 million during the quarter, compared to analysts’ expectations of $285.58 million. BE Semiconductor Industries had a net margin of 28.42% and a return on equity of 51.09%.

BE Semiconductor Industries Stock Down 1.4%

Shares of OTCMKTS BESIY opened at $256.25 on Friday. The company has a quick ratio of 4.17, a current ratio of 4.74 and a debt-to-equity ratio of 1.11. BE Semiconductor Industries has a 52 week low of $122.81 and a 52 week high of $374.33. The firm has a 50-day moving average price of $314.36 and a 200 day moving average price of $257.88. The stock has a market capitalization of $18.58 billion, a price-to-earnings ratio of 84.02 and a beta of 1.97.

Analyst Ratings Changes

Several analysts have recently weighed in on BESIY shares. Zacks Research downgraded shares of BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a report on Friday, June 26th. Deutsche Bank Aktiengesellschaft restated a “buy” rating on shares of BE Semiconductor Industries in a research report on Friday, May 15th. Finally, Morgan Stanley reaffirmed an “overweight” rating on shares of BE Semiconductor Industries in a report on Tuesday, May 19th. Five analysts have rated the stock with a Buy rating and four have assigned a Hold rating to the company’s stock. According to data from MarketBeat, BE Semiconductor Industries has a consensus rating of “Moderate Buy”.

BE Semiconductor Industries Company Profile

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.