ASE Technology Holding Co., Ltd. (NYSE:ASX) Raises Dividend to $0.42 Per Share

ASE Technology Holding Co., Ltd. (NYSE:ASX) declared an annual dividend on Wednesday, June 17th. Shareholders of record on Monday, July 6th will be paid a dividend of 0.4171 per share by the semiconductor company on Friday, August 7th. This represents a yield of 111.0%. The ex-dividend date of this dividend is Monday, July 6th. This is a 16.2% increase from ASE Technology’s previous annual dividend of $0.36.

ASE Technology has increased its dividend by an average of 0.2%per year over the last three years. ASE Technology has a dividend payout ratio of 31.3% indicating that its dividend is sufficiently covered by earnings. Analysts expect ASE Technology to earn $1.17 per share next year, which means the company should continue to be able to cover its $0.26 annual dividend with an expected future payout ratio of 22.2%.

ASE Technology Stock Performance

Shares of NYSE ASX opened at $37.48 on Thursday. The business’s 50-day moving average price is $33.02 and its two-hundred day moving average price is $24.33. The company has a debt-to-equity ratio of 0.53, a current ratio of 1.15 and a quick ratio of 0.89. ASE Technology has a one year low of $9.30 and a one year high of $41.10. The company has a market capitalization of $83.33 billion, a P/E ratio of 55.11, a price-to-earnings-growth ratio of 0.94 and a beta of 1.72.

ASE Technology (NYSE:ASX) last issued its earnings results on Wednesday, April 29th. The semiconductor company reported $0.20 EPS for the quarter, beating analysts’ consensus estimates of $0.17 by $0.03. ASE Technology had a return on equity of 13.48% and a net margin of 7.03%.The firm had revenue of $5.43 billion for the quarter, compared to the consensus estimate of $5.32 billion. Analysts anticipate that ASE Technology will post 0.82 earnings per share for the current fiscal year.

About ASE Technology

ASE Technology Holding Co, Ltd. (NYSE: ASX), commonly referred to as ASE, is a Taiwan-based provider of semiconductor assembly and testing services. The company focuses on back-end semiconductor manufacturing and related services that prepare integrated circuits and other semiconductor devices for final use. Its core activities include advanced IC packaging, final testing, wafer probing, and related engineering and supply-chain support for semiconductor customers.

ASE offers a range of products and technical capabilities designed to meet increasingly complex packaging and system-in-package requirements.