Taiwan Semiconductor Manufacturing Company Ltd. (TSM) to Issue Quarterly Dividend of $0.95 on July 9th

Taiwan Semiconductor Manufacturing Company Ltd. (NYSE:TSM) declared a quarterly dividend on Tuesday, February 10th. Stockholders of record on Thursday, June 11th will be paid a dividend of 0.9503 per share by the semiconductor company on Thursday, July 9th. This represents a c) annualized dividend and a dividend yield of 0.9%. The ex-dividend date is Thursday, June 11th.

Taiwan Semiconductor Manufacturing has raised its dividend by an average of 0.1%annually over the last three years. Taiwan Semiconductor Manufacturing has a dividend payout ratio of 27.8% meaning its dividend is sufficiently covered by earnings. Research analysts expect Taiwan Semiconductor Manufacturing to earn $19.05 per share next year, which means the company should continue to be able to cover its $3.01 annual dividend with an expected future payout ratio of 15.8%.

Taiwan Semiconductor Manufacturing Trading Up 2.9%

Shares of TSM opened at $427.11 on Tuesday. Taiwan Semiconductor Manufacturing has a 52-week low of $205.87 and a 52-week high of $450.16. The business’s fifty day moving average is $389.92 and its 200-day moving average is $349.23. The company has a debt-to-equity ratio of 0.16, a quick ratio of 2.31 and a current ratio of 2.49. The firm has a market cap of $2.22 trillion, a price-to-earnings ratio of 35.53, a PEG ratio of 1.21 and a beta of 1.39.

Taiwan Semiconductor Manufacturing (NYSE:TSM) last issued its quarterly earnings results on Tuesday, February 10th. The semiconductor company reported $3.11 earnings per share (EPS) for the quarter. Taiwan Semiconductor Manufacturing had a return on equity of 36.81% and a net margin of 46.97%.The company had revenue of $30.65 billion for the quarter. Equities analysts anticipate that Taiwan Semiconductor Manufacturing will post 15.29 EPS for the current fiscal year.

Taiwan Semiconductor Manufacturing News Roundup

Here are the key news stories impacting Taiwan Semiconductor Manufacturing this week:

• Positive Sentiment: TSMC was highlighted as a beneficiary of the AI buildout after reports on Apple’s AI plans, broader interest in chip foundries, and investor attention on TSMC as a top AI holding helped reinforce the bullish long-term demand story. Taiwan Semiconductor (TSM) Is A Top AI Stock In Billionaire Ken Fisher’s Portfolio
• Positive Sentiment: TSMC also showcased manufacturing strength at its 2026 Technology Symposium, saying it has accelerated fab expansion, which supports the view that it can keep up with strong AI chip demand. TSMC (TSM) Showcases Manufacturing Excellence at 2026 Technology Symposium
• Positive Sentiment: The stock has also benefited from a broader tech rally and a reported move higher in recent trading, with investors continuing to favor leading AI semiconductor names. Why TSMC (TSM) Outpaced the Stock Market Today
• Neutral Sentiment: Alphabet’s reported plan to use Intel for some custom AI chip production could slightly diversify the supply chain away from TSMC, but it mainly reflects overall strong demand for AI chips rather than a direct setback for TSMC. Alphabet Intel Chip Pact Reshapes AI Supply Chain And Investor Outlook
• Negative Sentiment: U.S. lawmakers are pressing for tighter export rules on contract chipmakers like TSMC to block advanced AI chips from reaching overseas subsidiaries of Chinese firms, which raises regulatory risk and could limit some future sales. US lawmakers urge tighter rules on contract chipmakers supplying Chinese firms’ overseas units

Taiwan Semiconductor Manufacturing Company Profile

Taiwan Semiconductor Manufacturing Company (TSMC) is a leading pure-play semiconductor foundry that provides wafer fabrication and related services to the global semiconductor industry. Founded in 1987 by Morris Chang and headquartered in Hsinchu, Taiwan, TSMC manufactures integrated circuits on behalf of fabless and integrated device manufacturers, offering contract chip production across a broad set of technologies and products.

TSMC’s service offering covers logic and mixed-signal process technologies, specialty processes for radio-frequency, power management and embedded memory, and advanced nodes used in mobile, high-performance computing and AI applications.