BE Semiconductor Industries (OTCMKTS:BESIY) Shares Gap Up – Still a Buy?

Shares of BE Semiconductor Industries NV (OTCMKTS:BESIYGet Free Report) gapped up prior to trading on Wednesday . The stock had previously closed at $212.04, but opened at $219.6325. BE Semiconductor Industries shares last traded at $219.6325, with a volume of 448 shares traded.

Analyst Ratings Changes

Several research firms have weighed in on BESIY. Kepler Capital Markets downgraded shares of BE Semiconductor Industries from a “strong-buy” rating to a “hold” rating in a research report on Friday, January 9th. Citigroup reiterated a “neutral” rating on shares of BE Semiconductor Industries in a research note on Tuesday, January 20th. Sanford C. Bernstein reissued an “outperform” rating on shares of BE Semiconductor Industries in a report on Sunday, January 4th. Berenberg Bank raised BE Semiconductor Industries to a “hold” rating in a research report on Monday, February 23rd. Finally, Morgan Stanley restated an “overweight” rating on shares of BE Semiconductor Industries in a research note on Tuesday, January 13th. Five research analysts have rated the stock with a Buy rating and six have given a Hold rating to the company. According to MarketBeat.com, BE Semiconductor Industries has an average rating of “Hold”.

Get Our Latest Report on BE Semiconductor Industries

BE Semiconductor Industries Stock Up 1.6%

The company has a debt-to-equity ratio of 1.46, a current ratio of 5.75 and a quick ratio of 5.02. The business’s fifty day simple moving average is $204.83 and its two-hundred day simple moving average is $172.45. The company has a market cap of $16.10 billion, a PE ratio of 118.70 and a beta of 1.81.

About BE Semiconductor Industries

(Get Free Report)

BE Semiconductor Industries NV (OTCMKTS:BESIY), commonly known as BESI, is a global supplier of assembly equipment for the semiconductor industry. The company designs, develops and manufactures capital equipment used in the back-end production of semiconductor devices, including die attach, wire bonding and flip chip packaging systems. BESI’s platforms support a wide range of applications from memory and logic chips to advanced power devices and radio-frequency modules, enabling high precision, throughput and yield in device assembly and test processes.

Founded in 1995 and headquartered in Duiven, the Netherlands, BESI went public on Euronext Amsterdam in 1999.

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