Tokyo Electron (OTCMKTS:TOELY) Releases FY 2026 Earnings Guidance

Tokyo Electron (OTCMKTS:TOELY) updated its FY 2026 earnings guidance on Friday. The company provided EPS guidance of 3.611-3.611 for the period. The company issued revenue guidance of $16.1 billion-$16.1 billion, compared to the consensus revenue estimate of $15.8 billion.

Wall Street Analyst Weigh In

Separately, Zacks Research lowered shares of Tokyo Electron from a “hold” rating to a “strong sell” rating in a report on Monday, September 22nd. One investment analyst has rated the stock with a Sell rating, According to MarketBeat, Tokyo Electron has a consensus rating of “Sell”.

Tokyo Electron Trading Up 0.6%

Shares of TOELY traded up $0.61 during midday trading on Friday, reaching $107.00. 111,126 shares of the company were exchanged, compared to its average volume of 154,625. Tokyo Electron has a 1-year low of $58.17 and a 1-year high of $114.53. The stock has a 50-day moving average price of $90.86 and a 200-day moving average price of $84.72. The company has a market cap of $98.59 billion, a price-to-earnings ratio of 27.16 and a beta of 1.93.

Tokyo Electron (OTCMKTS:TOELY) last posted its earnings results on Friday, October 31st. The company reported $0.90 earnings per share (EPS) for the quarter, beating analysts’ consensus estimates of $0.87 by $0.03. The business had revenue of $4.27 billion during the quarter, compared to analyst estimates of $4.06 billion. Tokyo Electron had a return on equity of 29.10% and a net margin of 21.74%. Equities research analysts anticipate that Tokyo Electron will post 3.23 earnings per share for the current year.

About Tokyo Electron

Tokyo Electron Limited, together with its subsidiaries, develops, manufactures, and sells semiconductor and flat panel display (FPD) production equipment in Japan, Europe, North America, Taiwan, China, South Korea, Southeast Asia, and internationally. The company offers coaters/developers, etch systems, surface preparation systems, deposition systems, test systems, wafer bonders/debonders, wafer edge trimming, SiC epitaxial CVD systems, gas cluster ion beam system, and cleaning systems.